What is HDI PCB? 

Product Company Basic Information: High-density interconnect circuit board (HDI PCB) is an advanced printed circuit board (PCB) designed to accommodate higher-density circuit components. HDI PCB employs fine lines and micro-holes technology, enabling the integration of more functions while occupying less space. This technology is particularly important for modern high-performance electronic devices as they require smaller, faster, and more powerful circuit boards.

High-quality HDI boards suitable for advanced electronic products 

At Linghangda, we are proud to be the industry-leading supplier of HDI PCBs. We provide high-quality, customized HDI PCB solutions for various industries. Our solutions cover HDI PCBs, which are renowned for their dense wiring on a small area. This makes them ideal choices for compact and high-performance electronic devices.

The micropores in HDI PCB 

One of the key features of our HDI PCB is its high component density and integrated micro vias. This not only enables a compact layout, but also allows for the use of thinner traces, smaller vias and pads. Therefore, our HDI boards are a popular choice for top manufacturers who wish to enhance performance while reducing product size.

In HDI PCB design, we employ various types of vias to achieve the required interconnections. These include:

01. Stack Through Holes 

These vias are directly located above the PCB multilayer board and are drilled using laser technology, filled with conductive material, to form the vertical stacking of the multilayer board. They are typically used in HDI PCBs to achieve precise connections in very compact areas and are commonly found in devices such as smartphones and tablets. 

02. Stacked Micropores 

This is a special variant of stacked through-holes, utilizing micro-through-holes. These micro-through-holes are usually filled and electroplated to ensure a secure connection. They are used to provide high-density inter-layer connections, especially in complex HDI PCB designs. 

03. Stacked Micropores 

Misaligned vias: These vias are located on different layers and are not directly aligned vertically. The vias are not stacked but are arranged in an interlaced manner, indirectly connecting multiple layers. Such vias are typically used in high-frequency or high-density PCBs, such as those used in RF or microwave applications.

Quality control and precision 

At Linghangda, we take pride in our product quality and meticulous precision. Our advanced production facilities, combined with strict quality control measures, enable us to provide high-quality HDI PCB solutions that meet international standards. We also employ advanced technologies such as laser drilling, high-precision copper plating, and advanced laminating processes to ensure that our HDI boards meet the required specifications. This emphasis on quality control allows us to create HDI PCB solutions for high-end electronic products with outstanding electrical performance and enhanced mechanical stability.

Why choose Linghangda as an HDI PCB supplier? 

As a reliable HDI PCB supplier, Linghangda is committed to meeting the HDI board requirements of industries such as automotive, medical, telecommunications and consumer electronics. These industries all need compact and high-performance solutions, and our HDI boards consistently meet this standard. Whether you are developing medical imaging equipment, advanced driver assistance systems or high-speed communication devices, Linghangda's HDI PCB can provide suitable solutions according to your specific needs. 

Characteristics

Micro holes: HDI PCBs use micro holes with diameters typically less than 0.006 inches (150 micrometers). These micro holes can be blind holes (connecting only the outer layer and one or more inner layers), buried holes (connecting only between inner layers), or through holes (passing through the entire circuit board). Using micro holes can significantly reduce the size and weight of the PCB while improving signal integrity. Fine lines and fine spacing: Allow for narrower line widths and spacings, typically less than 100 micrometers. This enables more complex circuit designs and allows for more electronic components to be accommodated on the circuit board. 

Structure: HDI PCB can adopt a multi-layer stacked structure, by using multi-layer micropores and thin materials to make the interconnection more complex and compact. 

High-frequency performance: Due to a shorter signal path and optimized layout, HDI PCBs perform better in high-frequency applications, reducing signal loss and crosstalk. 

Improved electrical performance and signal integrity: Shorter signal paths and the use of microporous technology help reduce signal delay and enhance the overall circuit performance.